Eliminate Costly Component Out Of Pocket Defect Condition during Microelectronic Component Packaging/Shipping/Handling
نویسندگان
چکیده
High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin susceptible to “Component Out Of Pocket” (COOP) conditions that can occur during packaging, shipping, customer handling. This defect condition is especially problematic for automated assembly which strives be touch-free efficient with orderly device presentation. COOP a major contributor “Cost Poor Quality” (COPQ) within the business. A funded study into was conducted dozen root causes were identified. It discovered traditional “waffle packs” mechanical issues related flatness tolerances respect waffle tray lid. The addition of standard clip further contributes issue, both are key costly condition. novel Lid-Clip System (LCS2) engineered compensate those issues, bringing robust captivation preservation pockets. Static dissipative material lid selected provide unparalleled ESD Class 000 protection high lowest voltage susceptibility thresholds.
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ژورنال
عنوان ژورنال: IMAPS symposia and conferences
سال: 2023
ISSN: ['2380-4505']
DOI: https://doi.org/10.4071/001c.74530